Design_of_EMC_for_PCB

说明：  ：高速混合PCB 的电磁兼容性设计首要解决合理安排布局布线和接地问题。分析基频和高频谐波、信号上 升或下降速率，电路的等效分布参数，传导耦合、辐射耦合和不匹配线的辐射、串音干扰等。根据板层、电源平面、 时钟电路和高频电路的布线原则进行布局布线。接地选择单点或多点接地。
(: High-speed mixed-EMC Design of PCB settlement of reasonable arrangements for the layout of the primary wiring and grounding problems. Analysis of fundamental frequency and high frequency harmonics, the signal rise or fall rate, the distribution of the equivalent circuit parameters, coupled conduction, radiation coupling and does not match the line of radiation, such as crosstalk interference. According to lamellar, power plane, clock circuits and high-frequency circuit wiring principles of placement and routing. Select a single point grounding or grounding.)